Details
- Title: 2024 IEEE Technology & Engineering Management Conference - Asia Pacific (TEMSCON-ASPAC 2024)
- Date/Location: Held 25-27 September 2024, Denpasar, Indonesia.
- IEEE #: CFP24AK5-POD
- ISBN: 9798331515898
- Pages: 521 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2025 )
Description
Members/Attendees
Tab 4
- Title: 2024 IEEE Technology & Engineering Management Conference - Asia Pacific (TEMSCON-ASPAC 2024)
- Date/Location: Held 25-27 September 2024, Denpasar, Indonesia.
- IEEE #: CFP24AK5-POD
- ISBN: 9798331515898
- Pages: 521 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2025 )