Details
- Title: 2025 Optical Interconnects and Packaging Conference (OIP 2025)
- Date/Location: Held 16-18 June 2025, Fort Collins, Colorado, USA.
- IEEE #: CFP25HSD-POD
- ISBN: 9798331585402
- Pages: 24 (1 Vol)
- Format: Softcover
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2025 )
Description
Members/Attendees
Tab 4
- Title: 2025 Optical Interconnects and Packaging Conference (OIP 2025)
- Date/Location: Held 16-18 June 2025, Fort Collins, Colorado, USA.
- IEEE #: CFP25HSD-POD
- ISBN: 9798331585402
- Pages: 24 (1 Vol)
- Format: Softcover
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2025 )