2025 IEEE INTERNATIONAL CONFERENCE ON FLEXIBLE AND PRINTABLE SENSORS AND SYSTEMS (FLEPS 2025)

Item #:
081957
$107.00 - $214.00
Adding to cart… The item has been added

Details

  • Title: 2025 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2025)
  • Date/Location: Held 22-25 June 2025, Singapore.
  • IEEE #: CFP25T72-POD
  • ISBN: 9798331510008
  • Pages: 232 (1 Vol)
  • Format: Softcover
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Nov 2025 )

Description

 

Members/Attendees

 

Tab 4

 
  • Title: 2025 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2025)
  • Date/Location: Held 22-25 June 2025, Singapore.
  • IEEE #: CFP25T72-POD
  • ISBN: 9798331510008
  • Pages: 232 (1 Vol)
  • Format: Softcover
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Nov 2025 )