Details
- Title: 2025 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2025)
- Date/Location: Held 1-4 June 2025, Split, Croatia.
- IEEE #: CFP25DTI-POD
- ISBN: 9781665477956
- Pages: 117 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2025 )
Description
Members/Attendees
Tab 4
- Title: 2025 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2025)
- Date/Location: Held 1-4 June 2025, Split, Croatia.
- IEEE #: CFP25DTI-POD
- ISBN: 9781665477956
- Pages: 117 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2025 )