Details
- Title: 2025 IEEE Hot Chips 37 Symposium (HCS 2025)
- Date/Location: Held 24-26 August 2025, Stanford, California, USA.
- IEEE #: CFP25HCS-POD
- ISBN: 9798331503017
- Pages: 440 (1 Vol)
- Format: Softcover
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2025 )
Description
Members/Attendees
Tab 4
- Title: 2025 IEEE Hot Chips 37 Symposium (HCS 2025)
- Date/Location: Held 24-26 August 2025, Stanford, California, USA.
- IEEE #: CFP25HCS-POD
- ISBN: 9798331503017
- Pages: 440 (1 Vol)
- Format: Softcover
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2025 )