Details
- Title: 2025 26th International Conference on Electronic Packaging Technology (ICEPT 2025)
- Date/Location: Held 5-7 August 2025, Shanghai, China.
- IEEE #: CFP25553-POD
- ISBN: 9781665477369
- Pages: 2,137 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2025 )
Description
Members/Attendees
Tab 4
- Title: 2025 26th International Conference on Electronic Packaging Technology (ICEPT 2025)
- Date/Location: Held 5-7 August 2025, Shanghai, China.
- IEEE #: CFP25553-POD
- ISBN: 9781665477369
- Pages: 2,137 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2025 )