Details
- Title: 2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2025)
- Date/Location: Held 27-30 May 2025, Dallas, Texas, USA.
- IEEE #: CFP25ITH-POD
- ISBN: 9798331524296
- Pages: 1,474 (2 Vols)
- Format: Softcover
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2025 )
Description
Members/Attendees
Tab 4
- Title: 2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2025)
- Date/Location: Held 27-30 May 2025, Dallas, Texas, USA.
- IEEE #: CFP25ITH-POD
- ISBN: 9798331524296
- Pages: 1,474 (2 Vols)
- Format: Softcover
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2025 )