Details
- Title: 2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2025)
- Date/Location: Held 5-8 August 2025, Bayan Lepas, Malaysia.
- IEEE #: CFP25777-POD
- ISBN: 9798331549435
- Pages: 514 (1 Vol)
- Format: Softcover
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2026 )
Description
Members/Attendees
Tab 4
- Title: 2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2025)
- Date/Location: Held 5-8 August 2025, Bayan Lepas, Malaysia.
- IEEE #: CFP25777-POD
- ISBN: 9798331549435
- Pages: 514 (1 Vol)
- Format: Softcover
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2026 )