Details
- Title: 2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2025)
- Date/Location: Held 21-24 October 2025, Taipei, Taiwan.
- IEEE #: CFP2559B-POD
- ISBN: 9798331548971
- Pages: 558 (1 Vol)
- Format: Softcover
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2026 )
Description
Members/Attendees
Tab 4
- Title: 2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2025)
- Date/Location: Held 21-24 October 2025, Taipei, Taiwan.
- IEEE #: CFP2559B-POD
- ISBN: 9798331548971
- Pages: 558 (1 Vol)
- Format: Softcover
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2026 )