Details
- Title: 2025 IEEE 31st International Symposium for Design and Technology in Electronic Packaging (SIITME 2025)
- Date/Location: Held 22-25 October 2025, Brasov, Romania.
- IEEE #: CFP2507I-POD
- ISBN: 9798331568702
- Pages: 506 (1 Vol)
- Format: Softcover
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2026 )
Description
Members/Attendees
Tab 4
- Title: 2025 IEEE 31st International Symposium for Design and Technology in Electronic Packaging (SIITME 2025)
- Date/Location: Held 22-25 October 2025, Brasov, Romania.
- IEEE #: CFP2507I-POD
- ISBN: 9798331568702
- Pages: 506 (1 Vol)
- Format: Softcover
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2026 )