Details
- Title: 2025 International Workshop on Advanced Interconnects (WAI 2025)
- Date/Location: Held 5-7 November 2025, Ningbo, China.
- IEEE #: CFP259A5-POD
- ISBN: 9798331593469
- Pages: 122 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2026 )
Description
Members/Attendees
Tab 4
- Title: 2025 International Workshop on Advanced Interconnects (WAI 2025)
- Date/Location: Held 5-7 November 2025, Ningbo, China.
- IEEE #: CFP259A5-POD
- ISBN: 9798331593469
- Pages: 122 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2026 )