Details
- Title: 2025 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS 2025)
- Date/Location: Held 15-17 December 2025, Hokkaido, Japan.
- IEEE #: CFP25EDP-POD
- ISBN: 9798331596606
- Pages: 110 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2026 )
Description
Members/Attendees
Tab 4
- Title: 2025 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS 2025)
- Date/Location: Held 15-17 December 2025, Hokkaido, Japan.
- IEEE #: CFP25EDP-POD
- ISBN: 9798331596606
- Pages: 110 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2026 )