Details
- Title: 2026 International Conference on Embedded Systems, Mobile Communication and Computing (EMC? 2026)
- Date/Location: Held 12-14 January 2026, Hong Kong, China.
- IEEE #: CFP266AY-POD
- ISBN: 9798331577094
- Pages: 470 (1 Vol)
- Format: Softcover
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2026 )
Description
Members/Attendees
Tab 4
- Title: 2026 International Conference on Embedded Systems, Mobile Communication and Computing (EMC? 2026)
- Date/Location: Held 12-14 January 2026, Hong Kong, China.
- IEEE #: CFP266AY-POD
- ISBN: 9798331577094
- Pages: 470 (1 Vol)
- Format: Softcover
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2026 )