INTERNATIONAL CONFERENCE ON MECHATRONIC ENGINEERING AND ARTIFICIAL INTELLIGENCE (MEAI 2024) (2 PARTS)

Item #:

080938

Our Price: $215.00

Details

Title: International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2024)
Date/Location: Held 13-15 December 2024, Shenyang, China.
Series: Proceedings of SPIE Volume 13555
Editor: Hu, Liang
ISBN: 9781510689176
Pages: 996 (2 Vols)
Format: Softcover
TOC Link: View Table of Contents
Publisher: SPIE - International Society for Optics and Photonics
POD Publisher: Curran Associates, Inc. ( Jul 2025 )

Title: International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2024)
Date/Location: Held 13-15 December 2024, Shenyang, China.
Series: Proceedings of SPIE Volume 13555
Editor: Hu, Liang
ISBN: 9781510689176
Pages: 996 (2 Vols)
Format: Softcover
TOC Link: View Table of Contents
Publisher: SPIE - International Society for Optics and Photonics
POD Publisher: Curran Associates, Inc. ( Jul 2025 )