Details
- Title: Technical Symposium on Packaging Developments and Innovations: From System Design to Integrated Delivery 2008
- Date/Location: Held 13 November 2008, San Jose, California.
- ISBN: 9781605606828
- Pages: 167 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
- POD Publisher: Curran Associates, Inc. ( Feb 2009 )
Description
Members/Attendees
Tab 4
- Title: Technical Symposium on Packaging Developments and Innovations: From System Design to Integrated Delivery 2008
- Date/Location: Held 13 November 2008, San Jose, California.
- ISBN: 9781605606828
- Pages: 167 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
- POD Publisher: Curran Associates, Inc. ( Feb 2009 )