MATERIALS AND PROCESSES FOR ADVANCED INTERCONNECTS FOR MICROELECTRONICS. (SYMPOSIUM N AT THE 2008 MRS SPRING MEETING)

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  • Title: Materials and Processes for Advanced Interconnects for Microelectronics
  • Subtitle: Symposium N at the 2008 MRS Spring Meeting
  • Date/Location: Held 24-28 March 2008, San Francisco, California.
  • Series: Materials Research Society Symposium Proceedings Volume 1079
  • ISBN: 9781605608648
  • Pages: 223 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Cambridge University Press (CUP) / Materials Research Society (MRS)
  • POD Publisher: Curran Associates, Inc. ( Apr 2009 )

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  • Title: Materials and Processes for Advanced Interconnects for Microelectronics
  • Subtitle: Symposium N at the 2008 MRS Spring Meeting
  • Date/Location: Held 24-28 March 2008, San Francisco, California.
  • Series: Materials Research Society Symposium Proceedings Volume 1079
  • ISBN: 9781605608648
  • Pages: 223 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Cambridge University Press (CUP) / Materials Research Society (MRS)
  • POD Publisher: Curran Associates, Inc. ( Apr 2009 )