STRESS MANAGEMENT FOR 3D ICS USING THROUGH SILICON VIAS. SEMATECH WORKSHOP. 2010.

STRESS MANAGEMENT FOR 3D ICS USING THROUGH SILICON VIAS. SEMATECH WORKSHOP. 2010.

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010363
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  • Title: SEMATECH Workshop on Stress Management for 3D ICs using Through Silicon Vias 2010
  • Date/Location: Held 16 March 2010, Albany, New York, USA.
  • ISBN: 9781617822407
  • Pages: 203 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Sematech
  • POD Publisher: Curran Associates, Inc. ( Jan 2011 )

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  • Title: SEMATECH Workshop on Stress Management for 3D ICs using Through Silicon Vias 2010
  • Date/Location: Held 16 March 2010, Albany, New York, USA.
  • ISBN: 9781617822407
  • Pages: 203 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Sematech
  • POD Publisher: Curran Associates, Inc. ( Jan 2011 )