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STRESS MANAGEMENT FOR 3D ICS USING THROUGH SILICON VIAS. SEMATECH WORKSHOP. 2ND 2010.
- Item #:
- 010364
- UPC:
Details
-
Title:
Second SEMATECH Workshop on Stress Management for 3D ICs using Through Silicon Vias 2010
-
Date/Location:
Held 13 July 2010, San Francisco, California, USA.
-
ISBN:
9781617822414
-
Pages:
176 (1 Vol)
-
Format:
Softcover
-
TOC Link:
View Table of Contents
-
Publisher:
Sematech
-
POD Publisher:
Curran Associates, Inc. ( Jan 2011 )
-
Title:
Second SEMATECH Workshop on Stress Management for 3D ICs using Through Silicon Vias 2010
-
Date/Location:
Held 13 July 2010, San Francisco, California, USA.
-
ISBN:
9781617822414
-
Pages:
176 (1 Vol)
-
Format:
Softcover
-
TOC Link:
View Table of Contents
-
Publisher:
Sematech
-
POD Publisher:
Curran Associates, Inc. ( Jan 2011 )