WAFER-LEVEL PACKAGING CONFERENCE AND TABLETOP EXHIBITION. ANNUAL INTERNATIONAL. 7TH 2010. (IWLPC 2010)

WAFER-LEVEL PACKAGING CONFERENCE AND TABLETOP EXHIBITION. ANNUAL INTERNATIONAL. 7TH 2010. (IWLPC 2010)

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012998
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Details

  • Title: 7th Annual International Wafer-Level Packaging Conference & Tabletop Exhibition 2010 (IWLPC 2010)
  • Date/Location: Held 11-14 October 2010, Santa Clara, California, USA.
  • ISBN: 9781618391919
  • Pages: 230 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Surface Mount Technology Association (SMTA)
  • POD Publisher: Curran Associates, Inc. ( Nov 2011 )

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Tab 4

 
  • Title: 7th Annual International Wafer-Level Packaging Conference & Tabletop Exhibition 2010 (IWLPC 2010)
  • Date/Location: Held 11-14 October 2010, Santa Clara, California, USA.
  • ISBN: 9781618391919
  • Pages: 230 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Surface Mount Technology Association (SMTA)
  • POD Publisher: Curran Associates, Inc. ( Nov 2011 )