WAFER-LEVEL PACKAGING CONFERENCE AND TABLETOP EXHIBITION. ANNUAL INTERNATIONAL. 6TH 2009. (IWLPC 2009)

WAFER-LEVEL PACKAGING CONFERENCE AND TABLETOP EXHIBITION. ANNUAL INTERNATIONAL. 6TH 2009. (IWLPC 2009)

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014575
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Details

  • Title: 6th Annual International Wafer-Level Packaging Conference & Tabletop Exhibition 2009 (IWLPC 2009)
  • Date/Location: Held 27-30 October 2009, Santa Clara, California, USA.
  • ISBN: 9781618398130
  • Pages: 262 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Surface Mount Technology Association (SMTA)
  • POD Publisher: Curran Associates, Inc. ( May 2012 )

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Tab 4

 
  • Title: 6th Annual International Wafer-Level Packaging Conference & Tabletop Exhibition 2009 (IWLPC 2009)
  • Date/Location: Held 27-30 October 2009, Santa Clara, California, USA.
  • ISBN: 9781618398130
  • Pages: 262 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Surface Mount Technology Association (SMTA)
  • POD Publisher: Curran Associates, Inc. ( May 2012 )