Details
- Title: 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2016)
- Date/Location: Held 18-21 July 2016, Singapore.
- IEEE #: CFP16777-POD
- ISBN: 9781467382601
- Pages: 438 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2016 )
Description
Members/Attendees
Tab 4
- Title: 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2016)
- Date/Location: Held 18-21 July 2016, Singapore.
- IEEE #: CFP16777-POD
- ISBN: 9781467382601
- Pages: 438 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2016 )