Skip to main content
WAFER-LEVEL PACKAGING CONFERENCE. ANNUAL INTERNATIONAL. 3RD 2006. (IWLPC 2006)
- Item #:
- 032697
- UPC:
Details
-
Title:
3rd Annual International Wafer-Level Packaging Conference (IWLPC 2006)
-
Date/Location:
Held 1-3 November 2006, San Jose, California, USA.
-
ISBN:
9781510833029
-
Pages:
214 (1 Vol)
-
Format:
Softcover
-
TOC Link:
View Table of Contents
-
Publisher:
Surface Mount Technology Association (SMTA)
-
POD Publisher:
Curran Associates, Inc. ( Mar 2017 )
-
Title:
3rd Annual International Wafer-Level Packaging Conference (IWLPC 2006)
-
Date/Location:
Held 1-3 November 2006, San Jose, California, USA.
-
ISBN:
9781510833029
-
Pages:
214 (1 Vol)
-
Format:
Softcover
-
TOC Link:
View Table of Contents
-
Publisher:
Surface Mount Technology Association (SMTA)
-
POD Publisher:
Curran Associates, Inc. ( Mar 2017 )