PROCESSING MATERIALS OF 3D INTERCONNECTS, DAMASCENE AND ELECTRONICS PACKAGING 8. (PRiME 2016)

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034137
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Details

  • Title: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 8
  • Subtitle: PRiME 2016
  • Date/Location: Held 2-7 October 2016, Honolulu, Hawaii, USA.
  • Series: ECS Transactions Volume 75 No.07
  • Editor: Kondo, K. et al.
  • ISBN: 9781607687245
  • Pages: 47 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( May 2017 )

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  • Title: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 8
  • Subtitle: PRiME 2016
  • Date/Location: Held 2-7 October 2016, Honolulu, Hawaii, USA.
  • Series: ECS Transactions Volume 75 No.07
  • Editor: Kondo, K. et al.
  • ISBN: 9781607687245
  • Pages: 47 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( May 2017 )