Details
- Title: 2017 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP 2017)
- Date/Location: Held 17 June 2017, Austin, Texas, USA.
- IEEE #: CFP17SLP-POD
- ISBN: 9781538615379
- Pages: 49 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2017 )
Description
Members/Attendees
Tab 4
- Title: 2017 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP 2017)
- Date/Location: Held 17 June 2017, Austin, Texas, USA.
- IEEE #: CFP17SLP-POD
- ISBN: 9781538615379
- Pages: 49 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2017 )