Details
- Title: 2017 International Topical Meeting on Microwave Photonics (MWP 2017)
- Date/Location: Held 23-26 October 2017, Beijing, China.
- IEEE #: CFP17756-POD
- ISBN: 9781538607633
- Pages: 518 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2018 )
Description
Members/Attendees
Tab 4
- Title: 2017 International Topical Meeting on Microwave Photonics (MWP 2017)
- Date/Location: Held 23-26 October 2017, Beijing, China.
- IEEE #: CFP17756-POD
- ISBN: 9781538607633
- Pages: 518 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2018 )