SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE. IEEE. 2017. (S3S 2017)

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038628
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Details

  • Title: 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S 2017)
  • Date/Location: Held 16-19 October 2017, Burlingame, California, USA.
  • IEEE #: CFP17SOI-POD
  • ISBN: 9781538637678
  • Pages: 258 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2018 )

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  • Title: 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S 2017)
  • Date/Location: Held 16-19 October 2017, Burlingame, California, USA.
  • IEEE #: CFP17SOI-POD
  • ISBN: 9781538637678
  • Pages: 258 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2018 )