Details
- Title: 2018 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (SMILE 2018)
- Date/Location: Held 8-9 February 2018, Hsinchu, Taiwan.
- IEEE #: CFP18M95-POD
- ISBN: 9781538631843
- Pages: 63 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (SMILE 2018)
- Date/Location: Held 8-9 February 2018, Hsinchu, Taiwan.
- IEEE #: CFP18M95-POD
- ISBN: 9781538631843
- Pages: 63 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2018 )