Details
- Title: 2018 IEEE/ACM 4th International Workshop on Software Engineering for Smart Cyber-Physical Systems (SEsCPS 2018)
- Date/Location: Held 27 May - 3 June 2018, Gothenburg, Sweden.
- IEEE #: CFP18C63-POD
- ISBN: 9781538661796
- Pages: 53 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE/ACM 4th International Workshop on Software Engineering for Smart Cyber-Physical Systems (SEsCPS 2018)
- Date/Location: Held 27 May - 3 June 2018, Gothenburg, Sweden.
- IEEE #: CFP18C63-POD
- ISBN: 9781538661796
- Pages: 53 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2018 )