ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS. IEEE CONFERENCE. 27TH 2018. (EPEPS 2018)

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041849
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  • Title: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2018)
  • Date/Location: Held 14-17 October 2018, San Jose, California, USA.
  • IEEE #: CFP18EPP-POD
  • ISBN: 9781538651674
  • Pages: 313 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2019 )

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  • Title: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2018)
  • Date/Location: Held 14-17 October 2018, San Jose, California, USA.
  • IEEE #: CFP18EPP-POD
  • ISBN: 9781538651674
  • Pages: 313 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2019 )