Details
- Title: 2018 IEEE Third International Workshop on Dynamic Software Documentation (DySDoc3 2018)
- Date/Location: Held 25 September 2018, Madrid, Spain.
- IEEE #: CFP18R92-POD
- ISBN: 9781538675717
- Pages: 17 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2019 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE Third International Workshop on Dynamic Software Documentation (DySDoc3 2018)
- Date/Location: Held 25 September 2018, Madrid, Spain.
- IEEE #: CFP18R92-POD
- ISBN: 9781538675717
- Pages: 17 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2019 )