SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE. IEEE. 2018. (S3S 2018)

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042324
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  • Title: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S 2018)
  • Date/Location: Held 15-18 October 2018, Burlingame, California, USA.
  • IEEE #: CFP18SOI-POD
  • ISBN: 9781538676288
  • Pages: 231 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Feb 2019 )

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  • Title: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S 2018)
  • Date/Location: Held 15-18 October 2018, Burlingame, California, USA.
  • IEEE #: CFP18SOI-POD
  • ISBN: 9781538676288
  • Pages: 231 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Feb 2019 )