Details
- Title: 2018 International Wafer Level Packaging Conference (IWLPC 2018)
- Date/Location: Held 23-25 October 2018, San Jose, California, USA.
- IEEE #: CFP18WAF-POD
- ISBN: 9781538693087
- Pages: 234 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2019 )
Description
Members/Attendees
Tab 4
- Title: 2018 International Wafer Level Packaging Conference (IWLPC 2018)
- Date/Location: Held 23-25 October 2018, San Jose, California, USA.
- IEEE #: CFP18WAF-POD
- ISBN: 9781538693087
- Pages: 234 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2019 )