MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE. 13TH 2018. (IMPACT 2018) (USB)

MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE. 13TH 2018. (IMPACT 2018) (USB)

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047427
$115.50 - $231.00
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Details

  • Title: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2018)
  • Date/Location: Held 24-26 October 2018, Taipei, Taiwan.
  • IEEE #: CFP1859B-USB
  • ISBN: 9781538656143
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2019 )

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  • Title: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2018)
  • Date/Location: Held 24-26 October 2018, Taipei, Taiwan.
  • IEEE #: CFP1859B-USB
  • ISBN: 9781538656143
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2019 )