Details
- Title: 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2018)
- Date/Location: Held 16-18 December 2018, Chandigarh, India.
- IEEE #: CFP18EDP-POD
- ISBN: 9781538665930
- Pages: 152 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2019 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2018)
- Date/Location: Held 16-18 December 2018, Chandigarh, India.
- IEEE #: CFP18EDP-POD
- ISBN: 9781538665930
- Pages: 152 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2019 )