Details
- Title: 2023 IEEE International Conference on Big Data and Smart Computing (BigComp 2023)
- Date/Location: Held 13-16 February 2023, Jeju, South Korea.
- Editor: Byun, Hyeran et al.
- IEEE #: CFP2340X-POD
- ISBN: 9781665475792
- Pages: 426 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2023 )
Description
Members/Attendees
Tab 4
- Title: 2023 IEEE International Conference on Big Data and Smart Computing (BigComp 2023)
- Date/Location: Held 13-16 February 2023, Jeju, South Korea.
- Editor: Byun, Hyeran et al.
- IEEE #: CFP2340X-POD
- ISBN: 9781665475792
- Pages: 426 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2023 )