Details
- Title: 2023 International Conference on Asian Language Processing (IALP 2023)
- Date/Location: Held 18-20 November 2023, Singapore.
- Editor: Wang, Lei et al.
- IEEE #: CFP2344I-POD
- ISBN: 9798350330793
- Pages: 387 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2024 )
Description
Members/Attendees
Tab 4
- Title: 2023 International Conference on Asian Language Processing (IALP 2023)
- Date/Location: Held 18-20 November 2023, Singapore.
- Editor: Wang, Lei et al.
- IEEE #: CFP2344I-POD
- ISBN: 9798350330793
- Pages: 387 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2024 )