Details
- Title: 2024 9th International Conference on Integrated Circuits and Microsystems (ICICM 2024)
- Date/Location: Held 25-27 October 2024, Wuhan, China.
- IEEE #: CFP24H23-POD
- ISBN: 9798331520243
- Pages: 907 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2025 )
Description
Members/Attendees
Tab 4
- Title: 2024 9th International Conference on Integrated Circuits and Microsystems (ICICM 2024)
- Date/Location: Held 25-27 October 2024, Wuhan, China.
- IEEE #: CFP24H23-POD
- ISBN: 9798331520243
- Pages: 907 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2025 )