Details
- Title: 2025 31st International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV 2025)
- Date/Location: Held 21-26 September 2025, Chengdu, China.
- IEEE #: CFP25430-POD
- ISBN: 9798331526962
- Pages: 844 (1 Vol)
- Format: Softcover
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2026 )
Description
Members/Attendees
Tab 4
- Title: 2025 31st International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV 2025)
- Date/Location: Held 21-26 September 2025, Chengdu, China.
- IEEE #: CFP25430-POD
- ISBN: 9798331526962
- Pages: 844 (1 Vol)
- Format: Softcover
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2026 )