Details
- Title: 2026 IEEE Haptics Symposium (HAPTICS 2026)
- Date/Location: Held 29 March - 1 April 2026, Reno, Nevada, USA.
- IEEE #: CFP26317-POD
- ISBN: 9798331578992
- Pages: 308 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2026 )
Description
Members/Attendees
Tab 4
- Title: 2026 IEEE Haptics Symposium (HAPTICS 2026)
- Date/Location: Held 29 March - 1 April 2026, Reno, Nevada, USA.
- IEEE #: CFP26317-POD
- ISBN: 9798331578992
- Pages: 308 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2026 )