Details
- Title: 2026 1st International Electronics & Packaging Technologies Conference: Bridging Skills & Innovation for India's Industry (EPT India)
- Date/Location: Held 2-3 March 2026, Faridabad, India.
- IEEE #: CFP254AK-POD
- ISBN: 9798331558710
- Pages: 461 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2026 )
Description
Members/Attendees
Tab 4
- Title: 2026 1st International Electronics & Packaging Technologies Conference: Bridging Skills & Innovation for India's Industry (EPT India)
- Date/Location: Held 2-3 March 2026, Faridabad, India.
- IEEE #: CFP254AK-POD
- ISBN: 9798331558710
- Pages: 461 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2026 )