Details
- Title: 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2026)
- Date/Location: Held 19-22 April 2026, Warsaw, Poland.
- IEEE #: CFP26566-POD
- ISBN: 9798331562502
- Pages: 795 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2026 )
Description
Members/Attendees
Tab 4
- Title: 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2026)
- Date/Location: Held 19-22 April 2026, Warsaw, Poland.
- IEEE #: CFP26566-POD
- ISBN: 9798331562502
- Pages: 795 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2026 )