Details
- Title: 2026 International Conference on Multi-scale Artificial Intelligence (MAI 2026)
- Date/Location: Held 24-26 April 2026, Shenyang, China.
- IEEE #: CFP261BM-POD
- ISBN: 9798331545673
- Pages: 240 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2026 )
Description
Members/Attendees
Tab 4
- Title: 2026 International Conference on Multi-scale Artificial Intelligence (MAI 2026)
- Date/Location: Held 24-26 April 2026, Shenyang, China.
- IEEE #: CFP261BM-POD
- ISBN: 9798331545673
- Pages: 240 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2026 )