Details
- Title: 2026 IEEE 56th International Symposium on Multiple-Valued Logic (ISMVL 2026)
- Date/Location: Held 19-21 May 2026, Sendai, Japan.
- IEEE #: CFP26034-POD
- ISBN: 9798331559571
- Pages: 269 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2026 )
Description
Members/Attendees
Tab 4
- Title: 2026 IEEE 56th International Symposium on Multiple-Valued Logic (ISMVL 2026)
- Date/Location: Held 19-21 May 2026, Sendai, Japan.
- IEEE #: CFP26034-POD
- ISBN: 9798331559571
- Pages: 269 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2026 )