Details
- Title: 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS 2026)
- Date/Location: Held 14-18 April 2026, Hiroshima, Japan.
- IEEE #: CFP2689U-POD
- ISBN: 9798319505880
- Pages: 449 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2026 )
Description
Members/Attendees
Tab 4
- Title: 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS 2026)
- Date/Location: Held 14-18 April 2026, Hiroshima, Japan.
- IEEE #: CFP2689U-POD
- ISBN: 9798319505880
- Pages: 449 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2026 )