Details
- Title: 2026 ACM/IEEE International Conference on Embedded Artificial Intelligence and Sensing Systems - Posters and Demos (SenSys-Adjunct 2026)
- Date/Location: Held 12 May 2026, Sant-Malo, France.
- IEEE #: CFP267CH-POD
- ISBN: 9798319521323
- Pages: 180 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2026 )
Description
Members/Attendees
Tab 4
- Title: 2026 ACM/IEEE International Conference on Embedded Artificial Intelligence and Sensing Systems - Posters and Demos (SenSys-Adjunct 2026)
- Date/Location: Held 12 May 2026, Sant-Malo, France.
- IEEE #: CFP267CH-POD
- ISBN: 9798319521323
- Pages: 180 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2026 )