Details
- Title: 2026 International Conference on Artificial Intelligence and Materials (ICAIM 2026)
- Date/Location: Held 27-29 March 2026, Changsha, China.
- IEEE #: CFP263BJ-POD
- ISBN: 9798331582548
- Pages: 400 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2026 )
Description
Members/Attendees
Tab 4
- Title: 2026 International Conference on Artificial Intelligence and Materials (ICAIM 2026)
- Date/Location: Held 27-29 March 2026, Changsha, China.
- IEEE #: CFP263BJ-POD
- ISBN: 9798331582548
- Pages: 400 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2026 )