OPTICAL INTERCONNECTS AND PACKAGING 2025

OPTICAL INTERCONNECTS AND PACKAGING 2025

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079971
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  • Title: Optical Interconnects and Packaging 2025
  • Subtitle: At OPTO
  • Date/Location: Held 28-31 January 2025, San Francisco, California, USA.
  • Series: Proceedings of SPIE Volume 13372
  • Editor: Chen, Ray T.
  • ISBN: 9781510684928
  • Pages: 200 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: SPIE - International Society for Optics and Photonics
  • POD Publisher: Curran Associates, Inc. ( May 2025 )

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  • Title: Optical Interconnects and Packaging 2025
  • Subtitle: At OPTO
  • Date/Location: Held 28-31 January 2025, San Francisco, California, USA.
  • Series: Proceedings of SPIE Volume 13372
  • Editor: Chen, Ray T.
  • ISBN: 9781510684928
  • Pages: 200 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: SPIE - International Society for Optics and Photonics
  • POD Publisher: Curran Associates, Inc. ( May 2025 )