INTERNATIONAL CONFERENCE ON SENSOR TECHNOLOGY AND INFORMATION ENGINEERING (STIE 2026)

INTERNATIONAL CONFERENCE ON SENSOR TECHNOLOGY AND INFORMATION ENGINEERING (STIE 2026)

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Details

  • Title: International Conference on Sensor Technology and Information Engineering (STIE 2026)
  • Date/Location: Held 17-19 April 2026, Hefei, China.
  • Series: Proceedings of SPIE Volume 14258
  • Editor: Low, Siew Chun
  • ISBN: 9798902325871
  • Pages: 254 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: SPIE - International Society for Optics and Photonics
  • POD Publisher: Curran Associates, Inc. ( Sep 2026 )

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  • Title: International Conference on Sensor Technology and Information Engineering (STIE 2026)
  • Date/Location: Held 17-19 April 2026, Hefei, China.
  • Series: Proceedings of SPIE Volume 14258
  • Editor: Low, Siew Chun
  • ISBN: 9798902325871
  • Pages: 254 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: SPIE - International Society for Optics and Photonics
  • POD Publisher: Curran Associates, Inc. ( Sep 2026 )