WAFER-LEVEL PACKAGING CONFERENCE AND TABLETOP EXHIBITION. ANNUAL INTERNATIONAL. 8TH 2011. (IWLPC 2011)

WAFER-LEVEL PACKAGING CONFERENCE AND TABLETOP EXHIBITION. ANNUAL INTERNATIONAL. 8TH 2011. (IWLPC 2011)

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013442
Our Price: $160.00
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Details

  • Title: 8th Annual International Wafer-Level Packaging Conference & Tabletop Exhibition 2011 (IWLPC 2011)
  • Date/Location: Held 3-6 October 2011, Santa Clara, California, USA.
  • ISBN: 9781618393098
  • Pages: 170 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Surface Mount Technology Association (SMTA)
  • POD Publisher: Curran Associates, Inc. ( Jan 2012 )

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Tab 4

 
  • Title: 8th Annual International Wafer-Level Packaging Conference & Tabletop Exhibition 2011 (IWLPC 2011)
  • Date/Location: Held 3-6 October 2011, Santa Clara, California, USA.
  • ISBN: 9781618393098
  • Pages: 170 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Surface Mount Technology Association (SMTA)
  • POD Publisher: Curran Associates, Inc. ( Jan 2012 )