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WAFER-LEVEL PACKAGING CONFERENCE. ANNUAL INTERNATIONAL. 9TH 2012. (IWLPC 2012)
- Item #:
- 017331
- UPC:
Details
-
Title:
9th Annual International Wafer-Level Packaging Conference 2012 (IWLPC 2012)
-
Date/Location:
Held 5-8 November 2012, San Jose, California, USA.
-
ISBN:
9781622768974
-
Pages:
184 (1 Vol)
-
Format:
Softcover
-
TOC Link:
View Table of Contents
-
Publisher:
Surface Mount Technology Association (SMTA)
-
POD Publisher:
Curran Associates, Inc. ( May 2013 )
-
Title:
9th Annual International Wafer-Level Packaging Conference 2012 (IWLPC 2012)
-
Date/Location:
Held 5-8 November 2012, San Jose, California, USA.
-
ISBN:
9781622768974
-
Pages:
184 (1 Vol)
-
Format:
Softcover
-
TOC Link:
View Table of Contents
-
Publisher:
Surface Mount Technology Association (SMTA)
-
POD Publisher:
Curran Associates, Inc. ( May 2013 )