WAFER-LEVEL PACKAGING CONFERENCE. ANNUAL INTERNATIONAL. 9TH 2012. (IWLPC 2012)

WAFER-LEVEL PACKAGING CONFERENCE. ANNUAL INTERNATIONAL. 9TH 2012. (IWLPC 2012)

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017331
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Details

  • Title: 9th Annual International Wafer-Level Packaging Conference 2012 (IWLPC 2012)
  • Date/Location: Held 5-8 November 2012, San Jose, California, USA.
  • ISBN: 9781622768974
  • Pages: 184 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Surface Mount Technology Association (SMTA)
  • POD Publisher: Curran Associates, Inc. ( May 2013 )

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Tab 4

 
  • Title: 9th Annual International Wafer-Level Packaging Conference 2012 (IWLPC 2012)
  • Date/Location: Held 5-8 November 2012, San Jose, California, USA.
  • ISBN: 9781622768974
  • Pages: 184 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Surface Mount Technology Association (SMTA)
  • POD Publisher: Curran Associates, Inc. ( May 2013 )